Caracterización de placas de circuitos impresos de computadoras por difracción de rayos X (DRX) y microscopía electrónica de barrido (MEB) en conjunción con microanálisis por dispersión de energías (EDS)

Mirna Alejandra  Mesinas Romero; Isauro  Rivera Landero; María Isabel  Reyes Valderrama; Justo Fabian  Montiel Hernández; Juan  Hernández Ávila

doi:10.29057/aactm.v1i1.9925

Mirna Alejandra Mesinas Romero Universidad Autónoma del Estado de Hidalgo
Isauro Rivera Landero Universidad Autónoma del Estado de Hidalgo
María Isabel Reyes Valderrama Universidad Autónoma del Estado de Hidalgo https://orcid.org/0000-0002-1912-7998
Justo Fabian Montiel Hernández Universidad Autónoma del Estado de Hidalgo https://orcid.org/0000-0001-6890-6069
Juan Hernández Ávila Universidad Autónoma del Estado de Hidalgo https://orcid.org/0000-0002-0275-1196

DOI: https://doi.org/10.29057/aactm.v1i1.9925

Keywords: characterization, PCB, Gold

Abstract

It is estimated that, of the total solid waste worldwide, electrical and electronic equipment waste amounts to 10 to 12%, the result of rapid technological progress and therefore the obsolescence of equipment and devices; for this reason, this fraction of waste can be considered as a secondary source for the recovery of some precious metals and other metals. Therefore, a study was carried out; which consisted in a first stage of collecting computer printed circuit boards (PCI) randomly; of which some pins (from 2 to 3 per PCI) were manually extracted, which were characterized via DRX and SEM-EDS, finding that the pins that are located in areas that will provide plug and unplug service (connection pins) they are the ones that contain a greater amount of gold coating. Gold is usually present almost always as a thin coating on a non-noble metal alloy base, such as Cu, Fe, Ni, Zn. Gold percentages range between 78.25 and 98.30%.

Downloads

Download data is not yet available.

References

1. P. Petter, A. M. Veit, & A. M. Bernardes, “Evaluation of gold and silver leaching from printed circuit board of cellphones”, Waste Management, 2013, pp. 475-482.
2. B. H. Robinson, “E-waste: An assessment of global production and environmental impacts”, Science of the Total Environment, 408, 2009, pp. 183–191.
3. L. Flandinet, F. Tedjar, V. Ghetta, & J. Fouletier, “Metals recovering from waste printed circuit boards (WPCBs) using molten salts”, Journal of Hazardous Materials, Vol. 213-214, 2012, pp.
485-490.
4. I. Roman, GSMA. eWASTE EN AMÉRICA LATINA, Mayo de 2014. Obtenido de http://www.gsma.com/latinamerica/wp-content/uploads/2014/05/eWaste-Latam-Esp-ResEje.pdf
5. M. I. Reyes, I. Rivera, F. Patiño, M. Flores & M. Reyes, “Total recovery of gold contained in computer printed circuit boards, leaching kinetics of Cu, Zn and Ni”, Journal Mexican Chemical Society, Vol. 56, 2, 2012, pp. 144-148.
6. J. LaDou, “Printed circuit board industry”, International Journal of Hygiene and Environmental Health, 2006; 209(3), pp. 211-219.
7. G. Q. Wu & Z. K. Zhang,“Recycling of waste printed circuit boards”, Circuit World, 2010, pp.35-39.
8. T. K. C. Eswaraiaha, “Classification of metals and plastics from printed circuit boards (PCB)using air classifier”, Chemical Engineering and Processing, Vol. 47, 2008, pp. 565–576.
9. G. H. Chao, L. J. Wei, “Liberation characteristic and physical separation of printed circuit board (PCB)”, Waste Management, Vol. 31, 2011, pp. 2161–2166.
10. L. Flandinet, F. Tedjar, V. Ghetta & J. Fouletier, “Metals recovering from waste printed circuit boards (WPCBs) using molten salts”, Journal of Hazardous Materials,Vol. 213-214, 2012, pp.
485-490.
11. Y. V. Luciana Harue, “Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers”, Waste Management, Vol. 3, 2011, pp. 2553–2558.